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January 5, 2017

Imiklamo Ehlanganisiwe Yomjikelezo Nezandiso

RF Power Capacitors
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Imiklamo Ehlanganisiwe Yomjikelezo Nezandiso

Idizayini ye-IC noma idizayini edidiyelwe iyisigaba esingezansi sobunjiniyela be-elekthronikhi, esizungeza amasu wokuklama we-logic kanye nowesifunda adingekayo ukuklama amasekethe ahlanganisiwe, noma ama-IC. Ama-IC aqukethe izinto ezincane ezisebenza ngogesi ezifana nama-resistors, ama-transistors, ama-capacitors, njll. Okwenziwe kwigridi kagesi kwi-semolonductor ye-monolithic.

Idizayini ye-Digital ne-analog IC yizigaba ezimbili ezibanzi zedizayini ye-IC. Izinto ezifana nama-microprocessors, ama-FPGA, izinkumbulo ezahlukahlukene (njenge: I-RAM, i-ROM, ne-flash) nama-ASIC edijithali akhiqizwa nge-digital IC design. Amaphuzu agxila kakhulu ekwakhiweni kwedijithali angukunemba okunengqondo, aqinisekise ukuminyana kwesekethe okuphezulu, nokubeka amasekethe ukuqinisekisa ukuhanjiswa kahle kwezimpawu zesikhathi nesikhathi. Idizayini ye-Power IC kanye ne-RF IC kuyizinkambu lapho ukwakheka kwe-Analog IC kunolwazi. Idizayini ye-Analog IC isetshenziswa ekwakhiweni kwezihibe ezikhiyiwe zesigaba, ama-op-amps, ama-oscillator, abalawuli abaqondile nezihlungi ezisebenzayo. Idizayini ye-Analog iyakhathaza nge-physics yamadivayisi we-semiconductor njengokumelana, ukuzuza, ukusabalalisa amandla nokufana. Ukuqiniswa kokukhuliswa kwesiginali ye-analog nokuhlunga ngokuvamile kubaluleke kakhulu futhi ngenxa yalesi sizathu, amasekhethi ahlanganisiwe e-analog asebenzisa amadivayisi asebenza ngokuqhathaniswa nendawo kunamadizayini e-digital IC futhi ngokuvamile awaminyene kangako kuma-circry.

Ukuthembela kumadivayisi we-semiconductor ngezinhlelo ze-elekthronikhi kuyanda usuku nosuku ngoba izinga lokuhlanganisa likhula ngokushesha kunanini ngaphambili futhi kuyadingeka ukupakisha izifunda eziningi kumaphakeji amancane kakhulu. Izakhi ezahlukahlukene zesekethe, ezidingeka ukuqedela izinhlelo zamakhompiyutha ezinjenge, ama-capacitors, ama-transistors, ama-resistor, njll.

Lapho iphakethe liphethe i-silicon ngayinye (i-silicon germanium yamasekethe we-RF, noma i-gallium arsenide yamasekethe wemvamisa ye-microwave) eyakha noma iyiphi ingxenye yesekethe enkulu ye-elekthronikhi noma isistimu noma lonke uhlelo lwe-elekthronikhi lodwa ibizwa nge-Integrated Circuit (IC) . Lapho uhlelo olugcwele lwe-elekthronikhi lwenziwa yi-IC, kukhulunywa ngalo njenge-SoC (System on a Chip). Ama-IC wokuxhumana wanamuhla awomklamo weSoC.

I-MCM (iMultichip Module) iqukethe okungaphezu kokukodwa futhi iyisandiso ku-IC; singasho ukuthi ngokwesibonelo, amasekethe nezinzwa kufanele kufakwe ephaketheni ngalinye kepha okungenakwenzeka ukuthi kusethwe ekufeni komuntu ngamunye. I-MCM kukhulunywe ngayo njengesifunda se-hybrid ekuqaleni, esiqukethe ama-IC amaningi nezinto ezingasebenzi esisekelweni esivamile sesifunda esihlanganiswa ngabaqhubi abasethwe ngaphakathi kwalesi sizinda. Izinkinga ezihlobene nokwehliswa kwesayizi nokucekelwa phansi kwesiginali kungancishiswa ngokusebenzisa i-MCM.

Isandiso ku-IC yimodyuli ye-multichip (MCM), equkethe okufayo okuningi; ngokwesibonelo, lapho izinzwa namasekhethi ezofakwa ephaketheni elilodwa kepha angenakwenziwa ngothile oyedwa. Ekuqaleni kwakubizwa ngokuthi isifunda se-hybrid, i-MCM iqukethe ama-IC amabili noma ngaphezulu kanye nezinto ezingenzi lutho esisekelweni sesifunda esivamile esixhunywe ngabaqhubi abenziwe ngaphakathi kwalesisekelo. I-MCM isiza ngenkinga yokunciphisa usayizi futhi isiza ekunciphiseni ukwehla kwesiginali.

Amadivayisi anqwabelene ngokuqondile kuhlelo kwiphakeji (i-SiP), okuyisandiso se-MCM. Ukuxhuma izintambo ku-substrate kujwayelekile. Isandiso ku-SiP yiphakeji esephakeji (PoP).

UDavid Smith, Iphini Likamongameli Ophakeme weUSComponent.com, umsabalalisi wemodyuli ye-IGBT kusukela ngo-2001.
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