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January 8, 2017

Ufuna ukwakhiwa kwe-pcb eC Chennai?

Ufuna ukwakhiwa kwe-pcb eC Chennai?

Ibhodi lesekethe ephrintiwe, noma i-PCB, isetshenziselwa ukusekela ngomshini kanye nokuxhuma ngogesi izingxenye ze-elekthronikhi kusetshenziswa izindlela eziqhutshwayo, amathrekhi noma imikhondo yesignali eqoshwe kumashidi ethusi alammele phezu kwe-non-conductive substrate. Ibuye ibizwe ngokuthi ibhodi lezintambo eziphrintiwe (PWB) noma ibhodi lezintambo elishunyekiwe. Amabhodi esekethe aphrintiwe asetshenziswa cishe kuwo wonke kodwa ezinsizeni zikagesi ezikhiqizwa ngokudayiswa kalula.

I-PCB egcwele izingxenye ze-elekthronikhi ibizwa ngokuthi umhlangano wesifunda ophrintiwe (PCA), umhlangano webhodi lesifunda ophrintiwe noma i-PCB Assembly (PCBA). Ekusetshenzisweni okungakahleleki igama elithi “PCB” lisetshenziswa womabili amabhodi angenalutho nahlanganisiwe, umongo ucacisa incazelo.

Izakhiwo zesiyingi ze-PCB

Umkhondo ngamunye uqukethe ingxenye eyisicaba, ewumngcingo ye-foil yethusi esala ngemva kokucwiliswa. Ukumelana, okunqunywa ububanzi nobukhulu, kwemikhondo kufanele kube phansi ngokwanele okwamanje umqhubi azowuthwala. Amandla kanye nokulandela umhlaba kungase kudingeke kube banzi kunokulandelela amasignali. Ebhodini elinezingqimba eziningi ungqimba olulodwa lonke lungase lube ithusi eliqinile ikakhulukazi ukuze lisebenze njengendiza ephansi yokuvikela nokubuyisela amandla.

Kumasekhethi e-microwave, imigqa yokudlulisela ingabekwa ngendlela ye-stripline kanye ne-microstrip enobukhulu obulawulwa ngokucophelela ukuze kuqinisekiswe ukuvinjelwa okungaguquki. Kumasekhethi omsakazo kanye nokushintsha okusheshayo i-inductance kanye nekhono lama-conductor webhodi lesifunda eliphrintiwe liba yizici ezibalulekile zesekethe, ngokuvamile ezingafuneki; kodwa zingasetshenziswa njengengxenye yamabomu yomklamo wesifunda, kugweme isidingo sezingxenye ezengeziwe ezihlukene.

Umhlangano wesifunda onyathelisiwe

Ngemva kokuba ibhodi lesifunda eliphrintiwe (PCB) seliqediwe, izingxenye ze-elekthronikhi kufanele zixhunywe ukwenza umhlangano wesifunda ophrintiwe osebenzayo, noma i-PCA (ngezinye izikhathi ebizwa ngokuthi “i-printed circuit board assembly” PCBA). Ekwakhiweni kwemigodi, izingxenye zokuhola zifakwa emigodini. Ekwakhiweni kwe-surface-mount, izingxenye zibekwe kumaphedi noma ezindaweni ezingaphandle kwe-PCB. Kuzo zombili izinhlobo zokwakha, izingxenye zokuhola zixhunywe ngogesi nangomshini ebhodini nge-solder yensimbi encibilikisiwe.

Kunezinhlobonhlobo zamasu okunamathisela asetshenziselwa ukunamathisela izingxenye ku-PCB. Ukukhiqizwa kwevolumu ephezulu kuvame ukwenziwa ngomshini wokubeka we-SMT kanye nohhavini abasodayo benqwaba noma abagelezayo, kodwa ochwepheshe abanekhono bayakwazi ukudayisa izingxenye ezincane kakhulu (ngokwesibonelo amaphakheji angu-0201 angu-0.02 ngo-0.01 in.) ngesandla ngaphansi kwesibonakhulu, besebenzisa ama-tweezers kanye ne-tip soldering iron enhle yama-prototypes amancane. Ezinye izingxenye kungase kube nzima kakhulu ukuze solder ngesandla, ezifana BGA amaphakheji.

Imvamisa, ukwakhiwa kwembobo kanye ne-surface-mount kumele kuhlanganiswe ndawonye ngoba ezinye izingxenye ezidingekayo zitholakala kuphela kumaphakheji angaphezulu, kanti ezinye zitholakala kuphela kumaphakheji we- through-hole. Esinye isizathu sokusebenzisa izindlela zombili ukuthi ukukhweza ngembobo kunganikeza amandla adingekayo ezingxenyeni ezingase zibekezelele ukucindezeleka ngokomzimba, kuyilapho izingxenye okulindeleke ukuthi zingathintwa zizothatha isikhala esincane zisebenzisa amasu okugibela phezulu.

Ngemuva kokuthi ibhodi seligcwalisiwe lingase lihlolwe ngezindlela ezihlukahlukene:

Ngenkathi amandla evaliwe, ukuhlolwa okubonakalayo, ukuhlolwa kokubona okuzenzakalelayo. Imihlahlandlela ye-JEDEC yokubekwa kwengxenye ye-PCB, i-soldering, nokuhlola ivame ukusetshenziswa ukuze kugcinwe ukulawulwa kwekhwalithi kulesi sigaba sokukhiqiza kwe-PCB.

Ngenkathi amandla evaliwe, ukuhlaziywa kwesiginesha ye-analog, ukuhlolwa kokucisha amandla.
Ngenkathi amandla evuliwe, ukuhlolwa kwe-in-circuit, lapho izilinganiso ezibonakalayo (okungukuthi i-voltage, imvamisa) zingenziwa.

Ngenkathi amandla evuliwe, ukuhlola okusebenzayo, ukuhlola nje ukuthi i-PCB iyakwenza yini ebidalelwe ukukwenza.

Ukuze kube lula lokhu kuhlola, ama-PCB angaklanywa ngamaphedi engeziwe ukuze enze ukuxhumana kwesikhashana. Ngezinye izikhathi la ma-pads kufanele ahlukaniswe ngama-resistors. Ukuhlolwa kwe-in-circuit kungase futhi kusebenzise izici zokuhlola ukuskena komngcele kwezinye izingxenye. Amasistimu okuhlola angaphakathi kwesekethe nawo angase asetshenziselwe ukuhlela izingxenye zememori ezingaguquki ebhodini.

Ekuhloleni ukuskena komngcele, amasekhethi okuhlola ahlanganiswe kuma-IC ahlukahlukene ebhodini enza ukuxhumana kwesikhashana phakathi kokulandelelwa kwe-PCB ukuze kuhlolwe ukuthi ama-IC agxunyekwe ngendlela efanele. Ukuhlola ukuskena komngcele kudinga ukuthi wonke ama-ICs ahlolwe asebenzise inqubo yokuhlola ejwayelekile, evame kakhulu okuyi-Joint Test Action Group (JTAG) ejwayelekile. Isakhiwo sokuhlola se-JTAG sinikeza indlela yokuhlola ukuxhuma phakathi kwamasekethe ahlanganisiwe ebhodini ngaphandle kokusebenzisa ama-probe okuhlola ngokomzimba. Abathengisi bamathuluzi e-JTAG bahlinzeka ngezinhlobo ezahlukahlukene zokuvuselela kanye nama-algorithms ayinkimbinkimbi, hhayi nje ukuthola amanethi ahlulekayo, kodwa futhi nokuhlukanisa amaphutha kumanethi athile, amathuluzi, nezikhonkwane.

Lapho amabhodi ehluleka ukuhlolwa, ochwepheshe bangase bachithe futhi bashintshe izingxenye ezihlulekile, umsebenzi owaziwa ngokuthi ukuvuselela kabusha.

Design

Ukwakhiwa kwemisebenzi yobuciko yebhodi lesifunda ephrintiwe ekuqaleni kwakuyinqubo eyenziwa ngesandla ngokugcwele eyenziwa emashidini e-mylar acacile esikalini esivame ukuphinda izikhathi ezi-2 noma ezi-4 kunosayizi ofisayo. Umdwebo wohlelo uqale waguqulwa waba ukwakheka kwamaphinikhodi wezingxenye, kwase kuba umzila wokulandela ukuze unikeze ukuxhumana okudingekayo. Amagridi e-mylar aphrintiwe ngaphambilini angakhiqizi asiza ekuhlelweni, futhi agcobe ukudluliselwa okomile kwezinhlelo ezivamile zezakhi zesifunda (amaphedi, iminwe yokuxhumana, amaphrofayili wesifunda ahlanganisiwe, njalonjalo) asize ukumisa ukwakheka. Imigqa phakathi kwamadivayisi yenziwa nge-tape yokuzinamathisela. Isakhiwo esiqediwe “sobuciko” sabe sesenziwa kabusha ngezithombe ezingqimbeni zamabhodi anezingubo zethusi ezingenalutho.

Ukwenza kwesimanje akudingi kakhulu abasebenzi ngoba amakhompyutha angenza ngokuzenzakalelayo izinyathelo eziningi zokuhlela. Ukuqhubekela phambili okujwayelekile komklamo webhodi lesifunda eliphrintiwe kuzobandakanya:
Ukuthwebula okuhleliwe ngethuluzi le-Electronic design automation.
Ubukhulu bekhadi nesifanekiso kunqunywa ngokusekelwe kumjikelezo odingekayo kanye nesimo Sokunquma izingxenye ezigxilile namasinki okushisa uma kudingeka.
Ukunquma izendlalelo zesitaki ze-PCB. Izendlalelo ezi-1 kuye kweziyi-12 noma ngaphezulu kuye ngobunkimbinkimbi bomklamo. Indiza ephansi kanye nendiza yamandla kuyanqunywa. Izindiza zesignali lapho amasignali aqondiswa khona zisendlaleni esiphezulu kanye nezendlalelo zangaphakathi.

Ukunqunywa kwe-impedance yomugqa kusetshenziswa ukujiya kongqimba lwe-dielectric, ukujiya komzila wethusi kanye nobubanzi bokulandelela. Ukuhlukaniswa kokulandelela nakho kucatshangelwe uma kwenzeka izimpawu ezihlukene. I-Microstrip, i-stripline noma i-dual stripline ingasetshenziswa ukwenza amasiginali womzila.

Ukubekwa kwezingxenye. Ukucatshangelwa kokushisa kanye nejometri kuyacatshangelwa. I-Vias nezindawo zimakiwe.

Ihambisa imikhondo yesignali. Ukuze uthole ukusebenza okuhle kwe-EMI amasignali amafrikhwensi aphezulu ahanjiswa ezendlalelo zangaphakathi phakathi kwamandla noma izindiza eziphansi njengoba izindiza zamandla ziziphatha njengendawo ye-AC.

Ukukhiqizwa kwefayela le-Gerber lokukhiqiza.

Ama-PWB anezingqimba eziningi

Inketho yokunikezela izendlalelo emhlabathini
Wakha izindiza eziyinkomba zamasignali
Ukulawulwa kwe-EMI
Ukulawulwa kwe-impedance okulula
Inketho yokunikezela izendlalelo ku-Supply Voltages
Ukusabalalisa kwamandla kwe-ESL/ESR okuphansi
Izinsiza zomzila ezengeziwe zamasignali

Ukucatshangelwa kukagesi ekukhetheni impahla

I-Dielectric Constant (imvume)
Uma uzinzile, ngcono
Amanani aphansi angase afaneleke kakhulu ukubalwa kwesendlalelo esiphezulu
Amanani aphezulu angase afaneleke kakhulu kwezinye izakhiwo ze-RF
I-Tangent yokulahlekelwa
Okuphansi, kungcono
Iba yinkinga kakhulu kumafrikhwensi aphezulu
Ukumuncwa komswakama
Okuphansi, kungcono
Ingenza i-dielectric constant kanye ne-tangent yokulahlekelwa
Ukuhlukaniswa kwe-Voltage
Okuphakeme, kungcono
Ngokuvamile akuyona inkinga, ngaphandle kwezinhlelo zokusebenza zamandla kagesi aphezulu
Ukuhlala
Okuphakeme, kungcono
Ngokuvamile akuyona inkinga, ngaphandle kwezinhlelo zokusebenza zokuvuza okuphansi

Ukwakhiwa kwemigodi yengeza ezindlekweni ngokudinga izimbobo eziningi ukuthi zibhojwe ngokunembile, futhi kukhawulele indawo etholakalayo yomzila ukuze uthole imikhondo yesignali kumaleya ngezansi kwesendlalelo esiphezulu kumabhodi ezendlalelo eziningi njengoba izimbobo kufanele zidlule kuzo zonke izendlalelo ziye kolunye uhlangothi.pcb isakhiwo Lapho ukufakwa kwe-surface-mounting sekuqalile ukusetshenziswa, izakhi ze-SMD ezinosayizi omncane zazisetshenziswa lapho kungenzeka khona, ngokufakwa kwembobo kuphela kwezingxenye ngokungafanele. pcb design enkulu yokufakwa phezulu ngenxa yezidingo zamandla noma ukulinganiselwa komshini, noma ngaphansi kwengcindezi yemishini engalimaza i-PCB.
Voltage High resistors , ,